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Speciality : Technology

 Materials
FR4, FR406, FR408, PTFE (Teflon), Polyimide, Multifunctional Epoxy, Ceramic Filled, GETEK®, Low Dk, High Tg

 Blind/Buried Vias

 Controlled Impedance/Dielectrics

 RoHS Compliant Process Finishes
Lead-free HAL, Immersion Silver, Electrolytic Soft/Hard Gold, Electroless Nickel/Immersion Gold (ENIG), Immersion Tin and OSP

 Sequential Lamination

 LPI Soldermask Filled Vias

 Material thickness from 0.005

 Line width tolerances +/- 0.0005

 Line width/spacing 5/5

 Castellation Holes (“half-moon” PTHs)

 Controlled Depth Drilling

 Edge/Cavity Plating


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